ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,911, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package" was invented by Eunsu Lee (Asan-si, South Korea) and Wooyoung Park (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include a first semiconductor chip flip-chip bonded to a top surface of a first circuit element, an insulating plate on the first circuit element and having a first through hole exposing the first semiconductor chip and a second through hole on one side portion of the insulating plate, a connection member in the second through hole and electrically connected to the fir...