US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Method for heat dissipation of electronic device and electronic device of same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,704,889, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method for heat dissipation of electronic device and electronic device of same" was invented by Sangheon Kim (Suwon-si, South Korea), Kwangtaek Woo (Suwon-si, South Korea), Jiwoo Lee (Suwon-si, South Korea) and Yonggil Han (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device according to an embodiment of the disclosure may include: two or more housings, a flexible display mounted to one or more housings among the two or more housings and configured to be expanded or reduced according to a sliding operation of one or mo...