US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Substrate processing apparatus, substrate processing method, and method of manufacturing semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,776, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing apparatus, substrate processing method, and method of manufacturing semiconductor device" was invented by Sangjine Park (Suwon-si, South Korea), Jihwan Park (Suwon si, South Korea) and Kuntack Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate processing apparatus including an index module including a load port in which a substrate is accommodated, a first transfer module and a second transfer module for loading and unloading the substrate, and a processing module that is connected to th...