US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Semiconductor chip and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,669, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor chip and semiconductor package including the same" was invented by Sehyun Hwang (Suwon-si, South Korea), Jongmin Lee (Suwon-si, South Korea), Joongwon Shin (Suwon-si, South Korea) and Jimin Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a semiconductor chip with a reduced thickness and improved reliability, and a semiconductor package including the semiconductor chip. The semiconductor chip includes a semiconductor substrate, an integrated device layer on the semiconductor substrate, a multi-wiring l...