ALEXANDRIA, Va., April 21 -- United States Patent no. 12,609,281, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Filament alignment device" was invented by Sangwoo Seon (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A filament alignment device for accommodating a PFG including a support plate, an insulator on the support plate, and a filament at an end portion of the insulator includes a main case having a first plate groove into which a first portion of the support plate is inserted and an open side surface, an auxiliary case for covering at least a first area of the open side surface of the main case and having a second plate groove into wh...