US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor chip including low-k dielectric layer" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,727, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor chip including low-k dielectric layer" was invented by Yeonjin Lee (Suwon-si, South Korea), Junyong Noh (Yongin-si, South Korea), Minjung Choi (Suwon-si, South Korea), Junghoon Han (Hwaseong-si, South Korea) and Yunrae Cho (Guri-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip includes a device layer on a substrate, the device layer including a plurality of semiconductor devices; a wiring structure and a lower inter-wiring dielectric layer each on the device layer, the lower inter-wiring dielectric layer s...