ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,543, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Manufacturing method of image sensor package" was invented by Sunjae Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of manufacturing an image sensor package, the method including preparing a device wafer including a plurality of chip portions and a scribe lane, forming a redistribution insulating film on a lower surface of the device wafer to cover a redistribution pattern and a portion of the redistribution pattern and to cover a lower surface of the device wafer, forming a redistribution pattern on a lowe...