US Patent Issued to SAMSUNG ELECTRONICS, UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY) on June 30 for "Complex of heterogeneous two-dimensional materials and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,320, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea) and UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY) (Ulsan, South Korea).

"Complex of heterogeneous two-dimensional materials and method of manufacturing the same" was invented by Minsu Seol (Seoul, South Korea), Hyeonsuk Shin (Ulsan, South Korea), Kyung-Eun Byun (Seongnam-si, South Korea), Hyuntae Hwang (Mokpo-si, South Korea), Changseok Lee (Suwon-si, South Korea) and Hyeongjoon Kim (Bucheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a complex of heterogeneous two-dimensional materials and a method of manufact...