US Patent Issued to SAMSUNG ELECTRONICS, TSC on Jan. 13 for "Wafer polishing apparatus and method of detecting defect of retainer ring included in the wafer polishing apparatus" (South Korean, American Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,769, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea) and TSC Inc. (Hwaseong-si, South Korea).

"Wafer polishing apparatus and method of detecting defect of retainer ring included in the wafer polishing apparatus" was invented by Jongsu Kim (Seongnam-si, South Korea), Johnho Kuk (Osan-si, South Korea), Sunil Park (Cedar Park, Texas), Kwangsung Lee (Yongin-si, South Korea), Yoichiro Iwa (Suwon-si, South Korea), Sewon Jeon (Hwaseong-si, South Korea) and Youngho Jung (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer polishing apparatus includes a base support; a polishing pad on the b...