ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,452, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and SEMES Co. LTD. (Cheonan-si, South Korea).

"Substrate processing apparatus and method thereof" was invented by Hae Won Choi (Daejeon, South Korea), Seung Min Shin (Suwon-si, South Korea), Sang Jine Park (Suwon-si, South Korea), Jae Won Shin (Suwon-si, South Korea), Ji Hwan Park (Hwaseong-si, South Korea), Kun Tack Lee (Suwon-si, South Korea), Koriakin Anton (Cheonan-si, South Korea), Joon Ho Won (Suwon-si, South Korea) and Pil Kyun Heo (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus and a substrate...