US Patent Issued to SAMSUNG ELECTRONICS, Korea University Research and Business Foundation on Feb. 10 for "Plasma-resistant member having stacked structure and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,992, issued on Feb. 10, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and Korea University Research and Business Foundation (Seoul, South Korea).

"Plasma-resistant member having stacked structure and method for fabricating the same" was invented by Inhwan Lee (Seoul, South Korea) and Kangbin Bae (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plasma-resistant member includes a lower layer disposed on a substrate and including yttrium oxide, a buffer layer disposed on the lower layer, and an upper layer disposed on the buffer layer and including yttrium oxyfluoride or fluorine-rich yttrium oxide, wherein th...