US Patent Issued to SAMSUNG ELECTRONICS, JM TECHNOLOGY on Aug. 18 for "Film adhesion apparatus for a housing of an electronic apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,072, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and JM TECHNOLOGY Co. LTD. (Gumi-si, South Korea).

"Film adhesion apparatus for a housing of an electronic apparatus" was invented by Jisung Kim (Suwon-si, South Korea), Hankil Park (Suwon-si, South Korea), Sehwan Hong (Suwon-si, South Korea), Myeonggeun Lee (Gumi-si, South Korea) and Seongjin Jeong (Gumi-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a film attachment apparatus for a housing of an electronic apparatus. The film attachment apparatus according to various embodiments, which adheres a film on the surface of a housin...