US Patent Issued to SAMSUNG ELECTRONICS, INHA Industry Partnership Institute on July 15 for "Method of manufacturing semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,360,451, issued on July 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and INHA Industry Partnership Institute (Incheon, South Korea).

"Method of manufacturing semiconductor device" was invented by Chawon Koh (Yongin-si, South Korea), Tsunehiro Nishi (Suwon-si, South Korea), Hyunwoo Kim (Seongnam-si, South Korea), Jinkyun Lee (Incheon, South Korea), Junil Kim (Suncheon-si, South Korea), Hyuntaek Oh (Incheon, South Korea), Jihoon Woo (Incheon, South Korea) and Seungsoo Choi (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device, the method including forming a photore...