US Patent Issued to SAMSUNG ELECTRONICS, ADEKA on May 19 for "Organometallic adduct compound and method of manufacturing integrated circuit device by using the same" (South Korean, Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,570, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and ADEKA Corp. (Tokyo).

"Organometallic adduct compound and method of manufacturing integrated circuit device by using the same" was invented by Seungmin Ryu (Hwaseong-si, South Korea), Younsoo Kim (Yongin-si, South Korea), Jaewoon Kim (Seoul, South Korea), Kazuki Harano (Tokyo), Kazuya Saito (Tokyo), Takanori Koide (Tokyo), Yutaro Aoki (Tokyo), Gyuhee Park (Hwaseong-si, South Korea), Younjoung Cho (Hwaseong-si, South Korea), Wakana Fuse (Tokyo), Yoshiki Manabe (Tokyo), Hiroyuki Uchiuzou (Tokyo), Masayuki Kimura (Tokyo) and Takahiro Yoshii (Tokyo).

According to the abstract* released by th...