US Patent Issued to SAMSUNG ELECTRONICS, Adeka on June 9 for "Materials for fabricating thin films, methods of fabricating thin films using the same, and equipment for fabricating thin films using the same" (South Korean, Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,649,757, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea) and Adeka Corp. (Tokyo).

"Materials for fabricating thin films, methods of fabricating thin films using the same, and equipment for fabricating thin films using the same" was invented by Seung-Min Ryu (Hwaseong-si, South Korea), Gyu-Hee Park (Hwaseong-si, South Korea), Youn Joung Cho (Hwaseong-si, South Korea), Kazuki Harano (Tokyo), Takanori Koide (Tokyo), Wakana Fuse (Tokyo), Yoshiki Manabe (Tokyo), Yutaro Aoki (Tokyo), Hiroyuki Uchiuzou (Tokyo) and Kazuya Saito (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Materials for fabricating a thin film that ...