US Patent Issued to SAMSUNG ELECTRONICS, Adeka on Aug. 4 for "Method of manufacturing semiconductor device" (South Korean, Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,937, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea) and Adeka Corp. (Tokyo).

"Method of manufacturing semiconductor device" was invented by Eunhyea Ko (Suwon-si, South Korea), Daihyun Kim (Suwon-si, South Korea), Thanh Cuong Nguyen (Suwon-si, South Korea), Soyoung Lee (Suwon-si, South Korea), Jihyun Lee (Suwon-si, South Korea), Hoon Han (Suwon-si, South Korea), Byungkeun Hwang (Suwon-si, South Korea), Hiroyuki Uchiuzou (Tokyo), Kiyoshi Murata (Tokyo), Tomoharu Yoshino (Tokyo) and Younjoung Cho (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor devi...