US Patent Issued to SAMSUNG ELECTRONICS, Adeka on Aug. 11 for "Compositions for manufacturing thin film and methods for manufacturing semiconductor device using the same" (South Korean, Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,798, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea) and Adeka Corp. (Tokyo).

"Compositions for manufacturing thin film and methods for manufacturing semiconductor device using the same" was invented by Jae Woon Kim (Seoul, South Korea), Seung-Min Ryu (Hwaseong-si, South Korea), Haruyoshi Sato (Tokyo), Kazuya Saito (Tokyo), Masayuki Kimura (Tokyo), Takahiro Yoshii (Tokyo), Tsubasa Shiratori (Tokyo), Min Jae Sung (Seoul, South Korea), Gyu-Hee Park (Hwaseong-si, South Korea) and Youn Joung Cho (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Compositions for manufacturing a thin film are ...