US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Sept. 9 for "Semiconductor chip and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,822, issued on Sept. 9, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor chip and semiconductor package including the same" was invented by Yun Tae Lee (Suwon-si, South Korea) and Jin Won Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a semiconductor chip including a front end of line (FEOL) layer and a first back end of line (BEOL) layer disposed on the FEOL layer; and a printed circuit board including a wiring layer and a second BEOL layer disposed on the wiring layer, wherein the semiconductor chip is mounted on the printed circuit board so tha...