ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,112, issued on Sept. 8, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Circuit board and manufacturing method thereof" was invented by Sangho Jeong (Suwon-si, South Korea), Yongduk Lee (Suwon-si, South Korea), Kihwan Kim (Suwon-si, South Korea), Changhwa Park (Suwon-si, South Korea) and Hyun Hu Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A disclosed circuit board may include: a first insulation layer, a conductive layer disposed on the first insulating layer; a first via layer disposed in the first insulating layer to be connected to the conductive layer; and a first wire layer disposed und...