ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,088, issued on Sept. 1, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board" was invented by Sang Ho Jeong (Suwon-si, South Korea), Jong Eun Park (Suwon-si, South Korea), Chang Hwa Park (Suwon-si, South Korea) and Hyun Hu Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a printed circuit board, including: a plurality of insulating layers having a through-portion; a plurality of wiring layers respectively disposed on or in the plurality of insulating layers; a plurality of via layers respectively penetrating through at least a portion of at least...