US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 14 for "Multilayer electronic component having external electrode which includes resin layer and conductive resin layer" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,538, issued on Oct. 14, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component having external electrode which includes resin layer and conductive resin layer" was invented by Byung Woo Kang (Suwon-si, South Korea), Jung Min Kim (Suwon-si, South Korea), Hong Je Choi (Suwon-si, South Korea), Ji Hye Han (Suwon-si, South Korea), Hye Jin Park (Suwon-si, South Korea), Su Yun Yun (Suwon-si, South Korea) and Sang Wook Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes: a body having a dielectric layer and first and second internal electro...