ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,462,981, issued on Nov. 4, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Jin Soo Park (Suwon-si, South Korea), Byung Jun Jeon (Suwon-si, South Korea) and Chul Seung Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes and including first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces, a first external electrode including a 1-1-th electrode layer disposed on the third surface, and a 1-2-th electrode layer dis...