ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,050, issued on Nov. 18, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Jong Ho Lee (Suwon-si, South Korea), Kyoung Jin Cha (Suwon-si, South Korea), Berm Ha Cha (Suwon-si, South Korea), Hyung Jong Choi (Suwon-si, South Korea) and Jin Woo Chun (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a capacitance formation portion in which a plurality of dielectric layers and a plurality of internal electrodes are alternately disposed in a first direction, a first cover portion disposed on one surface ...