US Patent Issued to SAMSUNG ELECTRO-MECHANICS on May 19 for "Multilayer capacitor having a dielectric layer with core-shell structured dielectric grains" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,633,459, issued on May 19, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer capacitor having a dielectric layer with core-shell structured dielectric grains" was invented by Kimyoung Yun (Suwon-si, South Korea), Chanhee Nam (Suwon-si, South Korea), Heesun Chun (Suwon-si, South Korea), Yongwoo Bae (Suwon-si, South Korea) and Mingon Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayered capacitor according to an embodiment includes a capacitor body that includes a dielectric layer and an internal electrode, and an external electrode that are disposed on the outside of the capacitor bo...