ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,722, issued on March 24, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Hyung Soon Kwon (Suwon-si, South Korea), Hyoung Uk Kim (Suwon-si, South Korea), Kyung Sik Kim (Suwon-si, South Korea), Ji Su Hong (Suwon-si, South Korea), Seung In Baik (Suwon-si, South Korea), Min Young Choi (Suwon-si, South Korea), Si Taek Park (Suwon-si, South Korea), Jong Hwan Lee (Suwon-si, South Korea) and Jae Sung Park (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a dielectric layer and internal electrodes; wherein the dielectr...