ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,086, issued on June 2, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Method of manufacturing printed circuit board" was invented by Myung Ju Gi (Suwon-si, South Korea) and Young Il Cho (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a printed circuit board includes forming an intermediate layer on a first conductive layer disposed on a first insulating layer, forming a second conductive layer and a second insulating layer on the intermediate layer, separating the first insulating layer from at least one portion of the first conductive layer, and etching the first conductiv...