ALEXANDRIA, Va., June 16 -- United States Patent no. 12,658,365, issued on June 16, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Han Sol Yun (Suwon-si, South Korea), Sung Hyung Kang (Suwon-si, South Korea), Ji Won Kim (Suwon-si, South Korea) and Min Goo Kang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and an internal electrode, alternately arranged in a first direction, and a cover portion disposed on both surfaces of the capacitance forming portion opposing the first direction; and an ...