ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,369, issued on July 7, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board" was invented by Sang Ho Jeong (Suwon-si, South Korea), Jong Eun Park (Suwon-si, South Korea), Chang Hwa Park (Suwon-si, South Korea) and Hyun Hu Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes a first insulating layer; a first wiring layer disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and having a cavity; and a first barrier layer having at least a portion disposed between ...