US Patent Issued to SAMSUNG ELECTRO-MECHANICS on July 28 for "Multilayer electronic component" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,033, issued on July 28, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component" was invented by Yong Park (Suwon-si, South Korea), Hye Yeon Kim (Suwon-si, South Korea), Kwan Soo Park (Suwon-si, South Korea), Jin Ho Choi (Suwon-si, South Korea), Jong Ho Lee (Suwon-si, South Korea), Eun Jung Lee (Suwon-si, South Korea), Yong Min Hong (Suwon-si, South Korea), Sun Mi Kim (Suwon-si, South Korea), Chang Ho Seo (Suwon-si, South Korea) and Young Rae Cho (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component according to an example embodiment of the present...