ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,142, issued on July 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board and method for manufacturing the same" was invented by Ki Hwan You (Suwon-si, South Korea), Seung Ju Lee (Suwon-si, South Korea), Tae Hun Kim (Suwon-si, South Korea), Chang Gon Kim (Suwon-si, South Korea), Yeon Ji Kim (Suwon-si, South Korea), Young Gon Kim (Suwon-si, South Korea), Ho Kwon Yoon (Suwon-si, South Korea) and Eun Seok Kang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: a first insulating layer; a first circuit layer disposed on one surface of the first insulati...