ALEXANDRIA, Va., July 21 -- United States Patent no. 12,688,971, issued on July 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Hong Gi Kim (Suwon-si, South Korea), Ji Won Lee (Suwon-si, South Korea), Byeong Hyeop Ha (Suwon-si, South Korea), Jin Il Kang (Suwon-si, South Korea) and Hong Seok Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction; an external electrode disposed outside the body; and an oxide layer disposed between the body a...