US Patent Issued to SAMSUNG ELECTRO-MECHANICS on July 15 for "Multilayer electronic component for enhanced moisture resistance and bending strength" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,100, issued on July 15, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component for enhanced moisture resistance and bending strength" was invented by Dong Yeong Kim (Suwon-si, South Korea), Ji Hong Jo (Suwon-si, South Korea) and Woo Chul Shin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an ...