US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Jan. 27 for "Substrate including bridge and electronic device" (South Korean Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,818, issued on Jan. 27, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Substrate including bridge and electronic device" was invented by Tae Hong Min (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate includes: a first printed circuit board layer including a first insulating layer and a first wiring layer, disposed on a lower surface of the first insulating layer; a second wiring layer, disposed on an upper surface of the first insulating layer; a bridge disposed above the first printed circuit board layer and including circuit wirings; a first bridge insulating layer and a second bridge i...