ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,548,714, issued on Feb. 10, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Cheol Woo Park (Suwon-si, South Korea), Jin Hyung Lim (Suwon-si, South Korea), Seung Hun Han (Suwon-si, South Korea) and Ji Hong Jo (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band po...