ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,548,713, issued on Feb. 10, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Seung Ho Shin (Suwon-si, South Korea), Ji Yeon Kim (Suwon-si, South Korea), Si Taek Park (Suwon-si, South Korea) and Sang Kyu Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer including Ba and Ti and an internal electrode disposed alternately with the dielectric layer; and an external electrode disposed on the body, wherein the dielectric layer further includes Li and F, and wherein a content of Li in...