ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,349, issued on Dec. 23, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Circuit board and manufacturing method thereof" was invented by Youngkyun Oh (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board according to an embodiment includes: an insulating layer; a conductive pad disposed on the insulating layer, a plating lead-in wire that is disposed on the insulating layer and is connected to the conductive pad; and a solder resist layer that is disposed on the insulating layer and includes a first opening overlapping the conductive pad and a second opening spaced apart from the first open...