ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,944, issued on Dec. 2, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Jun Oh Kim (Suwon-si, South Korea), Byung Kun Kim (Suwon-si, South Korea), Yu Hong Oh (Suwon-si, South Korea) and Hyun Ji Yang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and external electrodes disposed on the body. An average content of indium (In) relative to titanium (Ti) satisfies 0.3 at % or more and 3.8 at % or less in a region of the dielectric layer that is spaced ...