ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,250, issued on Aug. 11, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Sun Kyoung Park (Suwon-si, South Korea), Chae Dong Lee (Suwon-si, South Korea), Jung Wun Hwang (Suwon-si, South Korea) and Wi Hun Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component according to an example embodiment may include: a body including dielectric layers and internal electrodes; and an external electrode including a connection portion, and a band portion extending from the connection portion, wherein the external electrode may include an...