ALEXANDRIA, Va., April 7 -- United States Patent no. 12,597,562, issued on April 7, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Ji Young Lee (Suwon-si, South Korea), Joon Hyub Cha (Suwon-si, South Korea) and Dong Jun Jung (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component may include a body including a capacitance forming portion including a dielectric layer including a plurality of dielectric grains, and a plurality of internal electrodes alternately disposed to be stacked with the dielectric layer; and an external electrode disposed on the body, wherein the plurality of die...