ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,056, issued on April 15, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by So Jung An (Suwon-si, South Korea), Yoo Jeong Lee (Suwon-si, South Korea), Hyung Jong Choi (Suwon-si, South Korea), Chung Yeol Lee (Suwon-si, South Korea), Kwang Yeun Won (Suwon-si, South Korea), Woo Kyung Sung (Suwon-si, South Korea), Myung Jun Park (Suwon-si, South Korea) and Jong Ho Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including first and second surfaces opposing each other and third and fourth surfaces connected ...