US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 15 for "Method for compressing laminate and method for manufacturing ceramic electronic component including laminate" (South Korean Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,275,220, issued on April 15, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Method for compressing laminate and method for manufacturing ceramic electronic component including laminate" was invented by Yong Min Hong (Suwon-si, South Korea), Jong Ho Lee (Suwon-si, South Korea), Yeong Ju Choe (Suwon-si, South Korea), Chun Soo Kim (Suwon-si, South Korea), Ji Hun Jeong (Suwon-si, South Korea) and Je Sik Yeon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are relates to a method for compressing a laminate and a method for manufacturing a ceramic electronic component including a laminate. Th...