US Patent Issued to Salvia BioElectronics on Aug. 11 for "Implantable electrical device comprising a substrate, encapsulation layer and adhesion layer" (Dutch Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,209, issued on Aug. 11, was assigned to Salvia BioElectronics B.V. (Eindhoven, Netherlands).

"Implantable electrical device comprising a substrate, encapsulation layer and adhesion layer" was invented by Maartje Van Der Zalm (Eindhoven, Netherlands) and Stijn Willem Boere (Eindhoven, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implantable devices require protection to protect a human or animal body from implant contamination and to protect implant electrical connections and electronics from corrosion. Although PDMS can be substantially biocompatible, it still has a relatively high permeability to moisture which can lead to degradation...