ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,723, issued on March 24, was assigned to RUBYCON Corp. (Ina, Japan).
"Thin film high polymer laminated capacitor" was invented by Tomonao Kako (Shimoina-gun, Japan) and Chiharu Ito (Shimoina-gun, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thin film high polymer laminated capacitor includes: a laminated chip including dielectric layers, and internal electrode layers including first metal layers including a first metal vapor-deposited on the dielectric layers, and second metal layers including a second metal vapor-deposited on the first metal layers. The dielectric layers and the internal electrode layers are laminated and bonded alternat...