ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,774, issued on Nov. 3, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Katsuhiko Yoshihara (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a support member, semiconductor element, buffer layer and conductive member. The semiconductor element includes first and gate electrodes opposite from the side facing the support member in first direction. The semiconductor element is bonded to the support member. The buffer layer is electrically bonded to the first electrode. The conductive member is electrically bonded to the buffer layer. A first solid phase diffusion binding lay...