US Patent Issued to ROHM on June 23 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,630, issued on June 23, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device" was invented by Masahiko Arimura (Kyoto, Japan) and Daiki Yanagishima (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This semiconductor device is provided with: a high-voltage die pad and a low-voltage die pad, which are insulated from each other; a resistive element which is mounted on the high-voltage die pad; and a semiconductor element which is mounted on the low-voltage die pad. The resistive element is provided with: a substrate which is mounted on the high-voltage die pad; an insulating layer which is formed on the substrate; and a thin ...