ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,821, issued on July 28, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor equipment" was invented by Moe Yamaguchi (Kyoto, Japan), Hiroaki Matsubara (Kyoto, Japan), Yoshizo Osumi (Kyoto, Japan), Tomohira Kikuchi (Kyoto, Japan), Ryohei Umeno (Kyoto, Japan) and Taro Nishioka (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first die pad with a first obverse surface facing in z direction, a second die pad spaced from the first die pad and including a second obverse surface facing in z direction, a first semiconductor element on the first obverse surface, a second semiconductor element on the seco...