ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,073, issued on Feb. 24, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Control chip for leadframe package" was invented by Yuji Ishimatsu (Kyoto, Japan), Kenji Hama (Kyoto, Japan) and Hideo Hara (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes: an insulating substrate including an obverse surface facing a thickness direction; a wiring portion formed on the substrate obverse surface and made of a conductive material; a lead frame arranged on the substrate obverse surface; a first and a second semiconductor elements electrically connected to the lead frame; and a first control unit electrically connected to th...