ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,457, issued on Dec. 23, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Takaaki Yamanaka (Kyoto, Japan), Yuki Nakano (Kyoto, Japan) and Kenji Yamamoto (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a chip, an electrode that is formed on the chip, an inorganic insulating layer that covers the electrode and has a first opening exposing the electrode, an organic insulating layer that covers the inorganic insulating layer, has a second opening surrounding the first opening at an interval from the first opening, and exposes an inner peripheral edge of the inorganic insulat...