ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,123, issued on Dec. 23, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Xiaopeng Wu (Kyoto, Japan) and Takukazu Otsuka (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a conductive member having an obverse face, a semiconductor element mounted on the obverse face, and a conductive bonding material disposed between the conductive member and the semiconductor element, to conductively bond the conductive member and the semiconductor element together. The conductive bonding material includes a metal base layer, a first bonding layer, and a second bonding layer. The first bo...