US Patent Issued to ROHM on Aug. 26 for "Semiconductor device for suppressing excessive wetting and spreading of bonding layer" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,972, issued on Aug. 26, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device for suppressing excessive wetting and spreading of bonding layer" was invented by Tomonori Tanioka (Kyoto, Japan) and Kazuo Egami (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a support member including a main surface facing a thickness direction; a semiconductor element mounted on the main surface; and a bonding layer interposed between the support member and the semiconductor element, wherein the support member is formed with a first protrusion that protrudes from the main surface, and wherein the first protru...